Thermal FEA Analysis on Fins Structure

  1. Introduction
Three types of heat transfer [3]
Heat Transfer: Conduction [3]
Left: single layer chips without fins structure. Right: fin structure.
At the bottom of each structure, there is one heat generator which would simulates the heat of logic chip.
Left: fins structure. Right: single layer structure.
  4. The heat flux of the chips in this article “Cooling Limits for High Heat Flux Chips in Servers” (, it set the heat flux as 1000 W/cm2. But in this simulation we would like a exaggerated result, therefore we times 90 on it.




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Johnny Chen

Johnny Chen

Home page of Johnny, civil-PE-turned-mechanical-engineer

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